Abstract: The paper expounded the application of acoustic emission (AE) technology in bond-slip test. Firstly was used wavelet packet signal analysis technology to decompose and synthesize the AE signals during the bond-slip process. After that, the method of cross-correlation was applied to the synthesized signals to locate the source. Then, through the characteristics of AE signals to study process of bond-slip process. Lastly the AE evaluation method for the macroscopic fracture of bond was analyzed and summarized.