Abstract: The soldering characteristics of BGA package components were discussed and the inspection methods used in the BGA package components were summarized.The X-ray detection was used, then the area, centroid coordinate and roundness of each solder ball could be accurately estimated by using of the image processing technology. Hence, the defects of BGA solder joint, such as missing ball, extra ball, ball bridging, oversize or undersize, offset and deformation could be detected. The experiment proved that the system could fast and accurately detect the familiar defects of the BGA package components and guarantee the quality.