衍射方法监控键合线断裂

肖勇; 逄玉俊; 葛晓宇; 高淑芝

衍射方法监控键合线断裂

沈阳化工大学信息工程学院，辽宁110142

详细信息

作者简介:
肖勇(1974-)，男，博士，教授，研究方向为运动控制和光电传感。

中图分类号: TG115.28; TN219
计量
- 文章访问数: 0
- HTML全文浏览量: 0
- PDF下载量: 0
出版历程
- 收稿日期: 2011-01-01
- 刊出日期: 2011-12-09

Diffractive Method for Bonding Wire Breakage Monitoring

摘要

摘要: 在制造行业中，键合线广泛用于连接半导体芯片焊点和封装接线端。随着工厂自动化程度的不断提高，急需配置智能传感器来监控键合线的断丝故障，可是芯片和键合线的发展趋势是越来越精细，这给当前的键合线监控方法带来了严峻的挑战。提出了基于单缝衍射的精细键合线监控方法，通过观测特定衍射条纹的光强变化来判断键合线的存在与否。试验结果表明，对于直径为25 μm或更精细的键合线，此方法可以达到理想的监控效果。
- 键合线 /
- 衍射条纹 /
- 光强 /
- 光电阵列
Abstract: In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip. With advance of factory automation, it is necessary to introduce intelligent sensor to monitor breakage of bonding wire. As chip size and diameter of bonding wire become smaller and smaller, current monitoring methods encounter a lot of limitations. In this paper, a method to monitor breakage of fine bonding wires using single-slit diffraction is proposed, where irradiance variation of the corresponding diffraction pattern at the special receiver could be observed, due to the presence of a wire. Experimental results demonstrate that the proposed method renders satisfactory monitoring performance for bonding wire with a diameter of 25 μm or less.
- Bonding wire /
- Diffraction pattern /
- Irradiance /
- Photodiode Array(PDA)

HTML全文

参考文献(14)

[1]	Zhong Z W, Tee T Y, Luan J E. Recent advances in wire bonding flip chip and lead-free solder for advanced microelectronics packaging[J]. Microelectronics International,2007,24(3):18-26.
[2]	Kim J H, Cho J H, Lee S K. A design of hybrid contact detection algorithm for wire bonder machine[C]. IECON,2003(3):2963-2967.
[3]	Radav R, Varma S, Malaviya N. Performance analysis of optimized medium access control for wireless sensor network[J]. IEEE Sensors Journal,2010,10(12):1863-1868.
[4]	Rahmat M, Rozali S M, Wahab N A, et al. Application of draw wire sensor in position tracking of electro-hydraulic actuator system [J]. International Journal of Smart Sensing and Intelligent Systems,2010,3(4):736-755.
[5]	张海燕，刘镇清.人工智能及其在超声无损检测中的应用[J].无损检测,2001,23(8):356-360.
[6]	Perng D B, Chou C C, Lee S M. Design and development of a new machine vision wire bonding inspection system[J]. Microelectronics International,2007,34(3-4):323-334.
[7]	Shah A, Lee J, Mayer M, et al. Online methods to measure breaking force of bonding wire using a CMOS stress sensor and a proximity sensor[J]. Sensors and Actuators A: Physical,2008,148(2):462-471.
[8]	梁忠伟，任建民.集成电路芯片机器视觉监控技术研究[J].中国设备工程,2006(10):53-55.
[9]	段锦，景文博，祝勇，等.晶片键合线机视觉监控算法研究[J].封装、测试与设备,2009,34(7):641-644.
[10]	Jahn K, Bokor N. Intensity control of the focal spot by vectorial beam shaping[J]. Optics Communications,2010,283(24):4859-4865.
[11]	Singh N. Analysis of the spectral variation of a dye laser by gain medium inhomogeneity[J]. Optics & Laser Technology,2010,42(1):225-229.
[12]	Ersoy O K. Diffraction, Fourier Optics and Imaging[M]. New Jersey: John Wiley & Sons,2007.
[13]	喻力华，赵维义.圆孔衍射光强分布的数值计算[J].大学物理,2001,20(1):16-19.
[14]	张云哲.光栅衍射光强分布研究[J].科技向导,2010(29):43.

施引文献

资源附件(0)

计量

文章访问数: 0
HTML全文浏览量: 0
PDF下载量: 0
被引次数: 0

衍射方法监控键合线断裂

作者简介: 肖勇(1974-)，男，博士，教授，研究方向为运动控制和光电传感。

计量

出版历程

Diffractive Method for Bonding Wire Breakage Monitoring

计量

出版历程

目录

作者简介:
肖勇(1974-)，男，博士，教授，研究方向为运动控制和光电传感。