Abstract: With the widespread application of flip-chip integrated circuits in electronic products and the increasingly prominent issue of their failures, the requirements for their failure analysis technology have become increasingly demanding. The relationship among the transducer frequency, amplifier gain, and integrated circuits flip-chip thickness in C-scan mode of the acoustic microscope was explored. It was found that the clarity of ultrasonic scanning images was effectively improved with the increase in transducer frequency; at the same frequency, as the chip thickness increased, the gain of the amplifier was needed to be increased to ensure imaging quality. Furthermore, the application scenarios of acoustic microscopic C-scan detection technology in the failure analysis of flip-chip integrated circuits were investigated. The results indicated that this technology can nondestructively detect defects such as voids, delamination, and cracks inside flip-chip devices, enabling accurate judgment of failure mechanisms.