基于SSA-VMD-DTW的绝缘子脱黏缺陷成像
Imaging of insulator debonding defect based on SSA-VMD-DTW
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摘要: 复合绝缘子的高声衰减性和黏接结构特殊性会导致C扫描图像中出现异常高亮区域,为了有效消除其对自动化判别的影响,提出一种基于SSA-VMD-DTW算法的C扫描成像方法。首先,采集了3组不同距离的信号,分析对比3组原始数据的脱黏信号、界面信号和异常高亮信号,其信号差别能够明显区分;然后,对原始信号进行SSA-VMD模态分解去噪,计算IMF2分量与标准参考信号的DTW距离,将得到的相关系数矩阵与原始C扫描图像进行加权处理。试验结果表明,该方法可有效消除C扫描图像中的异常高亮区域,为后续的自动化缺陷判别奠定基础,同时也为相似结构工件的脱黏缺陷检测提供一种成像思路。Abstract: The high attenuation of composite insulator and the specificity of bonding structure will lead to abnormal highlight area in C-scan images. In order to effectively eliminate its influence on automatic discrimination, a C-scan imaging algorithm based on SSA-VMD-DTW was proposed. First, three groups of original signals at different distances were collected. The de-bonding signals, interface signals and abnormal highlight signals of the three groups of original data were analyzed and compared, which could clearly distinguish the signal differences. Then, the original signal was denoised by SSA-VMD mode decomposition, and the DTW distance between the IMF2 component and the standard reference signal was calculated, and the correlation coefficient matrix was obtained and weighted with the original C-scan images. Experimental results showed that the proposed method could effectively eliminate the abnormal highlights in C-scan images, and it laid a foundation for the automatic defect identification and provided an imaging idea for the defect detection of similar components.
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