Abstract: Industrial CT technology was used to monitor the shape of heteromorphic matters between injection molding pins of Hall current sensor and the bending, arcing and bonding of wires in the Hall chip. Through CT image analysis, the length and width of the heteromorphic matters were calculated quantitatively. Further, the molding process was improved. For the internal Hall chip, which is difficult to analyze and small in size, this research calculated the arc length, arc height, bending angle, solder ball diameter and other parameters of the wires in situ by analyzing industrial CT images. In this study, the information provided by industrial CT technology was used to optimize the process flow and manufacturing environment of Hall current sensor, so as to improve the device reliability and product quality.