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复杂曲面粘接结构的阵列成像检测

陆铭慧, 刘洋, 陈祎婷, 刘勋丰, 黄嘉诚, 董星宇

陆铭慧, 刘洋, 陈祎婷, 刘勋丰, 黄嘉诚, 董星宇. 复杂曲面粘接结构的阵列成像检测[J]. 无损检测, 2022, 44(9): 7-12. DOI: 10.11973/wsjc2022090002
引用本文: 陆铭慧, 刘洋, 陈祎婷, 刘勋丰, 黄嘉诚, 董星宇. 复杂曲面粘接结构的阵列成像检测[J]. 无损检测, 2022, 44(9): 7-12. DOI: 10.11973/wsjc2022090002
LU Minghui, LIU Yang, CHEN Yiting, LIU Xunfeng, HUANG Jiacheng, DONG Xingyu. Array imaging detection for complex curved surface bonding structure[J]. Nondestructive Testing, 2022, 44(9): 7-12. DOI: 10.11973/wsjc2022090002
Citation: LU Minghui, LIU Yang, CHEN Yiting, LIU Xunfeng, HUANG Jiacheng, DONG Xingyu. Array imaging detection for complex curved surface bonding structure[J]. Nondestructive Testing, 2022, 44(9): 7-12. DOI: 10.11973/wsjc2022090002

复杂曲面粘接结构的阵列成像检测

详细信息
    作者简介:

    陆铭慧(1963-),女,博士,教授,主要从事声学检测研究工作

    通讯作者:

    陆铭慧, E-mail:lunara@163.com

  • 中图分类号: TG115.28;V257

Array imaging detection for complex curved surface bonding structure

  • 摘要: 直升机桨叶前缘加热组件为复杂曲面多层粘接结构,其粘接质量影响着桨叶乃至整机的安全。目前针对加热组件脱粘缺陷的超声检测,存在缺陷信号提取困难、单探头检测效率低等问题。针对存在的问题,研究了声波在多层介质中的传播规律,明确了结构中不锈钢/橡胶粘接层缺陷的识别方法,针对加热组件的复杂形状及扫查需要制作了阵列探头,对试样及实际加热组件进行了阵列成像检测。结果表明,采用阵列成像方法可检测加热组件不锈钢/橡胶层的脱粘缺陷,且缺陷形貌准确清晰。
    Abstract: The leading edge heating component of helicopter blade is the multi-layer bonding structure with complex curved surface, and its bonding quality affects the safety of blade and even the whole machine. At present, there are some problems in ultrasonic detection of debonding defects of heating components, such as difficulty in extracting defect signal and low efficiency of single probe detection. Aiming at the existing problems, the propagation law of sound wave in multi-layer medium was studied, and the defect identification method of stainless steel/rubber bonding layer in the structure was clarified. According to the complex shape and scanning needs of heating components, an array probe was made, and the array imaging detection was carried out on the sample and actual heating components. The results show that the debonding defect of stainless steel / rubber layer of heating module can be detected by array imaging method, and the defect morphology was accurate and clear.
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出版历程
  • 收稿日期:  2022-03-07
  • 刊出日期:  2022-09-09

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