A New Signal Processing Method of Multi-Probe Metal Magnetic Memory Testing Instrument
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Graphical Abstract
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Abstract
The signal processing of metal magnetic memory(MMM) devices is performed mainly by calculating the gradient of the value of a single probe to determine the max of tangential MMM, and then to determine the location of stress concentration and injuries. Sometimes, defects are omitted with this method when detecting. A new way of signal processing was presented. By comparing signals from two sensors, it presents another way of determining the defects and their location.
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