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    ZHANG Guang-Wei, ZHANG Lai-Bin, FAN Jian-Chun, SUN Bing-Cai, QI Li-Juan, ZHAO Kun-Peng, ZHANG Ren-Qing. Packaging Technology of the Metal Magnetic Memory Sensor[J]. Nondestructive Testing, 2013, 35(1): 56-60.
    Citation: ZHANG Guang-Wei, ZHANG Lai-Bin, FAN Jian-Chun, SUN Bing-Cai, QI Li-Juan, ZHAO Kun-Peng, ZHANG Ren-Qing. Packaging Technology of the Metal Magnetic Memory Sensor[J]. Nondestructive Testing, 2013, 35(1): 56-60.

    Packaging Technology of the Metal Magnetic Memory Sensor

    • After analyzing the packaging structures of the Pressure Sensor and Fiber Bragg Grating(FBG) Senor, this paper summarized the principle of packaging and designing for the Metal Magnetic Memory(MMM) Sensor. Under the guidance of the principle, the author designed a new packing structure for MMM senor, and then the structure was simulated in the Solidworks successfully. The packaging structure passed through two rounds pressure testing, which proved the stability of the design structure.
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