Advanced Search
    WU Wen-Jun, QU Jun, ZHOU Hao. Laser Shearography Testing for Interface Debond Between Grain and Liner[J]. Nondestructive Testing, 2010, 32(5): 373-375.
    Citation: WU Wen-Jun, QU Jun, ZHOU Hao. Laser Shearography Testing for Interface Debond Between Grain and Liner[J]. Nondestructive Testing, 2010, 32(5): 373-375.

    Laser Shearography Testing for Interface Debond Between Grain and Liner

    • To research the application of Laser Shearography in testing bonding quality of the interface between grain and liner, main principle and course of Nondestructive Testing(NDT) were analyzed. According to experiment and testing of different grains, some improvement measure are given to solve the existing problems and improve efficiency. The debonding-area diameter >3 mm could be detected by the improved system. It can be used to test the quality of free-loading grain in production and using course.
    • loading

    Catalog

      Turn off MathJax
      Article Contents

      /

      DownLoad:  Full-Size Img  PowerPoint
      Return
      Return