Ultrasonic C-Scan Imaging Technology of Bonding Defects of Metal Ceramic

The bonding defects of the metal/ceramic were tested by applying ultrasonic C-scan imaging technology, and the characteristics of the main bonding defects of metal/ceramic were described. Combing ultrasonic C-scan imaging technology with manufacturing technology, the defects could be found in time and the production technology could be modified, the application had practical significance for improving the quality of the product.