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    WANG Jiasong, XU Jian, GU Jianzu. Acoustic emission evaluation method in bond-slip test[J]. Nondestructive Testing, 2024, 46(3): 24-27. DOI: 10.11973/wsjc202403006
    Citation: WANG Jiasong, XU Jian, GU Jianzu. Acoustic emission evaluation method in bond-slip test[J]. Nondestructive Testing, 2024, 46(3): 24-27. DOI: 10.11973/wsjc202403006

    Acoustic emission evaluation method in bond-slip test

    • The paper expounded the application of acoustic emission (AE) technology in bond-slip test. Firstly was used wavelet packet signal analysis technology to decompose and synthesize the AE signals during the bond-slip process. After that, the method of cross-correlation was applied to the synthesized signals to locate the source. Then, through the characteristics of AE signals to study process of bond-slip process. Lastly the AE evaluation method for the macroscopic fracture of bond was analyzed and summarized.
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