Defect area analysis based on ultrasonic C-scan digital image processing

In this paper, for superplastic forming diffusion bonding and composite parts, a defect area analysis method based on ultrasonic C-scan digital image processing is developed, and the corresponding GUI interface is developed. The GUI was used to analyze and process the ultrasonic C-scan images of typical superplastic forming diffusion joints and composite test pieces. The results show that the proposed method can analyze the defect area in test pieces with or without structural features, and calculate the intact rate. The proposed method has the characteristics of high accuracy, flexible operation and certain universality. The research work provides an effective solution for defect area analysis in ultrasonic C-scan images.