Ultrasonic C-scan imaging for explosive bonding plate

In order to improve the welding quality of the explosive bonding plate, it is necessary to understand the explosive layer combination. In this paper, the limitations of the current method for testing the bonding state of plates were analyzed, and the ultrasonic C-scan imaging technology was studied to determine the specific process parameters. For the explosive titanium/steel bonding plate produced, the interface was clearly imaged, and the clear recognition and accurate evaluation of the bonding quality were achieved.