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    YE Weiwen, DONG Yibiao. Acoustic Emission Monitoring of High Voltage Insulator Bonding Process[J]. Nondestructive Testing, 2018, 40(6): 1-5. DOI: 10.11973/wsjc201806001
    Citation: YE Weiwen, DONG Yibiao. Acoustic Emission Monitoring of High Voltage Insulator Bonding Process[J]. Nondestructive Testing, 2018, 40(6): 1-5. DOI: 10.11973/wsjc201806001

    Acoustic Emission Monitoring of High Voltage Insulator Bonding Process

    • In this paper, the relationship between acoustic emission parameters and tensile strength of bonding process is found through pressure tests under different pressure conditions, and the influence of fiber fracture on the judging results is also studied. Through the statistical analysis of the acoustic emission parameters corresponding to the different results of the tension test, the optimum conditions of determining the acoustic emission parameters, which are obviously related to the quality of the compression joint, are found through the different pressure processes in the pressure-holding stage, and the previous drawing of the acoustic emission parameters is improved. The fuzzy judgment method based on the human eye graph lays the foundation for the automatic recognition and decision algorithm of the machine.
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