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    HU Jiarui, LI Wenbo, LIU Chun, CHEN Hongdong, XIE Yi. Detection of GIS Equipment Conductor Defects by X-ray Digital Imaging and Analysis of Defect Causes[J]. Nondestructive Testing, 2017, 39(9): 76-79. DOI: 10.11973/wsjc201709019
    Citation: HU Jiarui, LI Wenbo, LIU Chun, CHEN Hongdong, XIE Yi. Detection of GIS Equipment Conductor Defects by X-ray Digital Imaging and Analysis of Defect Causes[J]. Nondestructive Testing, 2017, 39(9): 76-79. DOI: 10.11973/wsjc201709019

    Detection of GIS Equipment Conductor Defects by X-ray Digital Imaging and Analysis of Defect Causes

    • By using X-ray digital imaging system, the test on GIS equipment conductor found some defects on welded parts of the conductor, such as cracks and incomplete fusion. After disintegrating, the X-ray digital imaging result is consistent with the physical defects. Meanwhile, the results of the physical and chemical test show that the improper welding process is the root cause of defects of the conductor, and following that appropriate solutions are proposed.
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